Principal Engineer R&D - Build-up Process

Your Profile

Bachelor's or Master's degree in Materials Science, Chemical Engineering, Mechanical Engineering, Electronics Engineering, or a related field

10+ years of experience in substrate, PCB, semiconductor packaging, or related process technology development

Strong expertise in build-up process technologies including dielectric lamination, via formation, metallization, lithography, etching, and plating

Experience in process integration and technology development for high-density interconnect and advanced substrate applications

Knowledge of glass handling, temporary carrier/support systems, thin substrate processing, and defect control methodologies

Strong understanding of electrical and thermo-mechanical reliability requirements for advanced substrate technologies

Experience in process optimization, yield improvement, root cause analysis, and reliability enhancement

Proven ability to lead complex technical projects and drive cross-functional collaboration

Strong communication and problem-solving skills with the ability to influence technical direction and development strategy

Fluency in English