Expert - Substrate & Packaging Industrialization

Your profile

Bachelor’s or Master’s degree in Engineering, Materials Science, Electronics, or a related technical field

Several years (typically 5+ years) of experience in substrate, PCB, or advanced packaging manufacturing or process development environments

Experience working across R&D, engineering, experimental work and design of experiments (DoE), and production interfaces in a collaborative environment

Experience in IC substrate manufacturing, HDI technologies, integration or prototyping is an advantage

Strong understanding of manufacturing and assembly processes in substrate or packaging environments

Ability to translate technical concepts into feasible and stable process solutions under real production conditions

Understanding of process sensitivities, tolerances, and material interactions in high-precision assemblies

Structured, hands-on, and solution-oriented way of working with a focus on implementation

Fluency in English